Sealed pixel assemblies, kits and methods

ABSTRACT

Discrete flexible pixel assemblies can be hermetically sealed from the environment and can comprise unitary, self-contained replaceable modules which enable efficient, economical production of large scale, free-form electronic displays, signs and lighting effects for outdoor use. The method and means for producing hermetically sealed discrete flexible pixel assemblies can include encapsulation means, exterior encasement means, and cable connector means.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of and claims priority to U.S. patentapplication Ser. No. 14/027,419, filed Sep. 16, 2013, entitled “SEALEDPIXEL ASSEMBLIES, KITS AND METHODS,” which is a continuation of andclaims priority to U.S. patent application Ser. No. 12/987,584, filedJan. 10, 2011, assigned U.S. Pat. No. 8,552,928, entitled “SEALED PIXELASSEMBLIES, KITS AND METHODS,” which is a continuation of and claimspriority to U.S. patent application Ser. No. 11/895,424, filed Aug. 24,2007, assigned U.S. Pat. No. 7,868,903, entitled “FLEXIBLE PIXEL ELEMENTFABRICATION AND SEALING METHOD.” U.S. patent application Ser. No.11/895,424 claims priority from U.S. Provisional Application No.60/926,706 filed Apr. 27, 2007, entitled “FLEXIBLE PIXEL ASSEMBLIES FORMOUNTING ON IRREGULAR SURFACES,” and is a continuation-in-part of U.S.patent application Ser. No. 10/965,133 filed Oct. 14, 2004, entitled“FLEXIBLE PIXEL STRING HARDWARE AND METHOD,” assigned U.S. Pat. No.7,893,948, the entirety of each of the disclosures of which areexplicitly incorporated by reference herein.

This application is also related to U.S. patent application Ser. No.10/965,127 filed Oct. 14, 2004, entitled “FLEXIBLE PIXEL STRING SOFTWAREAND METHOD”, now abandoned, U.S. patent application Ser. No. 11/805,513filed May 23, 2007, entitled “TRANSLATION TABLE,” assigned U.S. Pat. No.8,001,455, and U.S. patent application Ser. No. 11/895,423 filed Aug.24, 2007, entitled “FLEXIBLE PIXEL ELEMENT AND SIGNAL DISTRIBUTIONMEANS,” assigned U.S. Pat. No. 8,344,410, the entirety of each of thedisclosures of which are explicitly incorporated by reference herein.

TECHNICAL FIELD

The present invention teaches a discrete flexible pixel assembly for usein flexible pixel strings and, more particularly, a fabrication methodand means for hermetic sealing of discrete flexible pixel assemblies.

Flexible pixel assemblies may be used in large scale, direct viewelectronic display devices and signage mounted on large area and/orirregular surfaces, such as the interior or exterior of buildings, wherethe intent is to complement the surface architecture of the building byconforming to the building surfaces. A particular problem arises withelectronic display devices used in outdoor or exterior displays such assigns since delicate electronic components in such displays are exposedto the detrimental effects of environment, rough handling and inclementweather and are therefore vulnerable to failure. The discrete flexiblepixel assembly, fabrication method and means for hermetic sealing of thepresent invention precludes failure of electronic components due to thedetrimental effects of environment, thereby enabling efficient,economical production of large scale, direct view electronic displaydevices, signage and lighting effects for outdoor use.

BACKGROUND

Electronic display devices and signage are known in the art. Anelectronic display device typically comprises a display board thatproduces visual images by means of a grid of small light emittingelements, such as incandescent bulbs, LEDs, or the like; data handlingand control means for managing transfer of digital image data fordisplay as visual output images, and means for converting digital imagedata into visual image data and display control signals to drive thelight emitting elements, or pixels, to thereby produce visual outputimages on the electronic display devices for viewing.

The sophistication of visual images that can be displayed on electronicdisplay devices is generally dependent on the capabilities of the lightemitting elements, or pixels, used to produce visual images. Lightemitting display technology has become increasingly more advanced in theart, progressing from monochrome incandescent and LED devices to videoquality components capable of exhibiting near continuous tone visualoutput, complex animations and live video streams. Improvements in lightemitting display technology, including light emitting elements, have inturn enabled the manufacture of electronic display devices that areincreasingly large in scale and more powerful in terms of the complexityand sophistication of the visual output images that can be displayed.

Electronic display devices and signage sited in outdoor locations, suchas on the exterior surfaces of buildings, are also known in the art.Outdoor electronic display devices and signage are commonly sited nearpublic venues where the visual output images they exhibit may be viewedsimultaneously by large numbers of people in groups. Outdoor electronicdisplay devices provide a valuable service to the public since they canprovide timely or time-critical information, such as stock and commodityprices, traffic and weather conditions, hazard alerts, and otherimportant information. One popular type of outdoor electronic displaydevice is a large scale video for advertising displays and signage wherecommercial messages are broadly and effectively exhibited for publicviewing.

An inherent problem in the design and manufacture of large scaleelectronic display devices for outdoor use is the need to protectdelicate and vulnerable internal electronic components from failure dueto the detrimental effects of environment. This problem is exacerbatedby the increasing sophistication of light emitting elements and theircollateral support electronics, such as the electronic drivers for thelight emitting elements. In the early art, incandescent bulbs served aslight emitting elements. Incandescent bulbs are comparativelyinexpensive to use, robust in operation and easy to replace; moreover,they require few and comparatively inexpensive collateral supportelectronics and power and signal conductors. More advanced lightemitting elements or pixels, such as LEDs and LCDs, are more expensiveto use and replace. In addition, they require more numerous and moreexpensive collateral support electronics, including pixel elementdrivers, data buffers, control signal handlers, over-voltage andtransient protection circuits, to name a few. Furthermore, advancedlight emitting elements and collateral support electronics arecomparatively much more delicate and easily damaged by electrostaticshock, thermal shock, mechanical shock, moisture and humidity, andvarious other detrimental environmental conditions. Advanced lightemitting elements and collateral support electronics also require moresophisticated means of mounting and electrical connection, such assurface mounted printed circuit boards (PCBs), as well as moresophisticated means of supplying operating power, digital image data anddisplay control signals, which means greatly increase the number ofsignal paths and conductors needed to service components and therebygreatly increase the number of connection points and potential points offailure. Therefore, the use of advanced light emitting elements, whilepresenting advantages in terms of the sophistication of visual outputimages that can be displayed, also presents a vulnerable designarchitecture with many potential points of failure.

In the prior art, light emitting elements are collectively sealed withinenclosures to protect them from the outside environment. Not only doesthis add to the cost of producing already expensive large scale outdoorelectronic displays and signage, but such enclosures are generallyeffective only for conventional, rectilinear or planar displays mountedon flat surfaces. Producing collective enclosures that conform toirregular shaped surfaces can be a complex and costly undertaking.Moreover, a collective enclosure typically embodies a single-pointfailure mode, wherein any failure of the collective enclosure exposesall the light emitting elements, collateral support electronics andconnection points contained therein to potential failure. Finally,collective enclosures are subject to overheating from both internal andexternal sources, including component power dissipation and solarradiation.

A solution to some of these problems is taught in co-pending U.S. patentapplication Ser. No. 11/895,423 entitled “FLEXIBLE PIXEL ELEMENT ANDSIGNAL DISTRIBUTION MEANS.” A portion of that teaching is the use of aplurality of discrete flexible pixel elements that can beinterchangeably connected in series by means of flexible cables toproduce flexible pixel strings that are conformable to irregular shapesand surfaces.

The present invention further discloses means and methods that areoperative and efficacious in manufacturing discrete flexible pixelelements, including a fabrication method and means for encapsulatingpixel element electronics, such as light emitting elements andcollateral support electronics, and encasing the encapsulated pixelelement electronics in an external top encasement cover in order toproduce a unitary, hermetically sealed, self-contained module that isprotected from the detrimental effects of the environment. The presentinvention also discloses means for connecting power and signal cables toa plurality of discrete flexible pixel elements in series connection,whereby electrical conductors and contacts within power and signalcables are similarly protected.

In summation, the prior art is generally dependent on conventionalmeans, such as collective enclosures, to protect pixel elementelectronics used in electronic display devices sited outdoors frompreventable failure and damage. Conventional collective enclosures arenot well suited for protecting electronic display devices that conformto irregular shapes and surfaces since they are difficult and expensiveto fabricate. Furthermore, they embody a single point failure mode whichexposes all internal components and connections to potential failure, aswell as being subject to overheating. As a result, production of suchenclosures is cost prohibitive, while outcomes are often inelegant andfailure prone. A novel approach to address the aforesaid deficiencies ofthe prior art is needed to continue to satisfy public demand and therebyensure continuing development of the art.

SUMMARY

The general purpose of the present invention is to protect delicate andvulnerable pixel element electronics used in discrete flexible pixelelements from failure and damage due to detrimental effects ofenvironment. More specifically, the present invention discloses afabrication method and means for hermetic sealing of pixel elementelectronics embodied within discrete flexible pixel elements. Thefabrication method comprises an encapsulation means and an externalcasement means. In addition, the fabrication method embodies connectionmeans for connecting power and signal cables conjoining a plurality ofdiscrete flexible pixel elements in series-connection, whereinelectrical conductors and terminal contacts embodied within said powerand signal cables are similarly protected.

The encapsulation means may include the use of a potting resin or gelthat encapsulates said pixel element electronics and hardens on exposureto the atmosphere, heat, or a reactive agent such as a hardener.Alternatively, the encapsulation means may include the use of a ductilefoam or malleable solid potting material having similar protectiveproperties in application and which harden by similar processes toachieve similar results.

External casement means may embody a formed top encasement cover ofplastic or similar material, wherein the top encasement cover has aninternal cavity configured to receive encapsulated pixel elementelectronics in assembly. The formed top encasement cover may betransparent to pass light from light emitting elements or may have holestherein enabling the light emitting elements to protrude therefrom inorder to pass light directly.

Alternatively, external casement means may embody a formed topencasement cover which has an internal cavity configured to receivepixel element electronics not yet encapsulated and which serves as apotting shell enabling pixel element electronics positioned therein tobe encapsulated in situ.

In another alternative embodiment, external casement means may embody aformed top encasement cover which is formed around encapsulated pixelelement electronics in a fused close fit therewith, such as by plasticforming or by an injection molding means.

In yet another alternative embodiment, the formed top encasement covermay have some corresponding fitting features adaptively to receive abarrier sealant means which may embody a ductile barrier sealant such ascaulk or a malleable barrier sealant such as sealing lace or cord or asolid barrier sealant such as a sealing gasket or O-ring, wherein saidcorresponding fitting features engage the barrier sealant in a close fittherewith to establish a sealed barrier to atmosphere.

Connection means for connecting power and signal cables conjoining aplurality of discrete flexible pixel elements in series connection mayembody formed cable connectors of plastic or similar material that houseand mechanically support electrical conductors and terminal contacts,wherein said formed cable connectors and terminal contacts havecorresponding fitting features which enable them to conjoin in a closemechanical fit to thereby establish series connections between aplurality of discrete flexible pixel elements, and wherein said closemechanical fit establishes a sealed barrier to the atmosphere.

According to one embodiment of the present invention, there is provideda fabrication method for hermetic sealing of pixel element electronicsembodied within discrete flexible pixel elements which comprises anencapsulation means, an external casement means and a connection meansfor connecting power and signal cables.

According to another embodiment of the present invention, there isprovided an encapsulation means that includes the use of a formedpotting shell which has fitting features for receiving a pixel elementelectronics assembly, further presenting cavities for receiving pottingmaterial, thereby enabling the encapsulation of said pixel elementelectronics assembly through the introduction of the potting material,and further having fitting features for receiving components of saidexternal casement means in a close fit therewith.

According to still another embodiment of the present invention, there isprovided a potting resin or gel that encapsulates a pixel elementelectronics assembly which potting resin or gel hardens by exposure tothe atmosphere or heat or by a reactive agent such as a hardener. Thepotting resin or gel is selected or formulated for optimal performancecharacteristics and properties efficacious for encapsulating pixelelement electronics of discrete flexible pixel elements and protectingthem from the detrimental effects of the environment.

According to yet another embodiment of the present invention, there isprovided an external casement means which embodies a formed topencasement cover and formed bottom plate of plastic or similar material,wherein the formed top encasement cover has an internal cavityconfigured to receive the encapsulated pixel element electronicsassembly and which further has fitting features to receive said formedbottom plate in close fit therewith, the formed top encasement coverhaving through holes therein to enable the light emitting elements toprotrude therefrom.

According to still another embodiment of the present invention, there isprovided connection means for connecting power and signal cables thatembody formed connector headers of plastic or similar material whichhouse and mechanically support electrical conductors and terminalcontacts and which have fitting features enabling them to conjoin in aclose mechanical fit, thereby establishing a sealed barrier to theenvironment.

A significant aspect and feature of the present invention is that thefabrication means which enables the hermetic sealing of delicate andvulnerable pixel element electronics contained within discrete flexiblepixel elements in order to protect them from failure and damage due tothe detrimental effects of the environment.

Another significant aspect and feature of the present invention is thatthe hermetically sealed discrete flexible pixel elements can betterwithstand the rough handling and mechanical shock during the shippingand assembly of electronic display devices and during required serviceand replacement thereof upon failure.

Yet another significant aspect and feature of the present invention isthat the hermetically sealed discrete flexible pixel elements can betterwithstand inclement weather, moisture and humidity, electrostatic shock,thermal shock, and other detrimental effects of the environment,therefore they are better adapted for application in outdoor sites.

Still another significant aspect and feature of the present invention isthat the hermetically sealed cable connectors and conductors supplyingsaid pixel element electronics will protect the terminal connectionsfrom possible failure and damage due to rough handling and thedetrimental effects of the environment.

A further significant aspect and feature of the present invention isthat the hermetically sealed flexible discrete pixel elements do notrequire expensive collective enclosures thereby preventing individualfailure of discrete flexible pixel elements and pixel elementelectronics embodied therein due to single-point failure of theenclosure.

A further significant aspect and feature of the present invention isthat the hermetically sealed discrete flexible pixel elements willensure greater longevity of pixel element electronics embodied thereinand are more easily replaced upon failure.

A final significant aspect and feature of the present invention is thatthe fabrication method and means for hermetic sealing of discreteflexible pixel elements provide a robust design architecture, animproved cost-benefit in the design, manufacture and maintenance oflarge scale, direct view electronic display devices and signage foroutdoor applications.

Having thus described embodiments of the present invention and settingforth significant aspects and features of the present invention, it isthe principal object of the present invention to provide a discreteflexible pixel element that is hermetically sealed from the environmentand embodied as a unitary, self-contained, replaceable module forefficient, economical production of large scale, free-form electronicdisplays, signs and lighting effects for outdoor applications. Thepresent invention teaches a fabrication method for producinghermetically sealed discrete flexible pixel elements including means forencapsulating pixel element electronics, exterior casement means, andcable connector means.

BRIEF DESCRIPTION OF THE DRAWINGS

Other objects of the present invention and many of the attendantadvantages of the present invention will be readily appreciated as thesame becomes better understood by reference to the following detaileddescription when considered in connection with the accompanyingdrawings, in which like reference numerals designate like partsthroughout the figures thereof and wherein:

FIG. 1 is an isometric view showing a hermetically sealed discreteflexible pixel element of the present invention embodying a unitary,self-contained, replaceable module;

FIG. 2 is a cross section side view of a pixel element electronicsassembly attached to a potting shell with fasteners;

FIGS. 3A and 3B are isometric top and bottom views of a pixel elementelectronics assembly and potting shell in assembly with potting materialbeing applied to upper and lower cavities in the potting shell;

FIG. 4 is an isometric assembly view of a discrete flexible pixelelement showing a pixel element electronics assembly and potting shellin assembly, top cover and bottom gasket;

FIG. 5 is an assembled view of the components of FIG. 4;

FIG. 6A is a cross section side view of a plurality of discrete flexiblepixel elements of the present invention in series connection with pixelelement electronics assemblies therein fully encapsulated by pottingmaterial and attached to a planar mounting surface;

FIG. 6B is similar to FIG. 6A but with the plurality of discreteflexible pixel elements attached to a non-planar or irregular surface;and,

FIG. 7 is a cross section side view of input and output cable connectorsof discrete flexible pixel elements showing corresponding matingcomponents and applied potting material.

DETAILED DESCRIPTION

FIG. 1 is an isometric view of a preferred embodiment of discreteflexible pixel element 10 of the present invention. The flexible pixelelement 10 embodies a printed circuit board assembly (not shown) onwhich various surface mounted electrical components are soldered ormechanically fastened to conductor pads by operative electricalconnection including a plurality of light emitting elements 13, topencasement cover 30, input connector 14, output connector 16, andflexible cables 18 embodying in assembly a unitary, self-contained,replaceable module. The light emitting elements 13, or pixels, areilluminated when energized by on-board pixel element drivers (not shown)to produce a visual output in the form of emitted light. In a preferredembodiment, the light emitting elements 13 comprise a plurality of red,green and blue (RGB) colored LEDs.

FIG. 2 is a cross section side view of potting assembly 20, a topencasement cover 30, and a bottom gasket 32. Printed circuit boardassembly 11 supports a plurality of surface mounted pixel elementelectronics 15, including light emitting elements 13 and pixel elementdrivers 15 a, in addition to other collateral support electronics, suchas resistors and capacitors (not shown), soldered or mechanicallyfastened to conductor pads by operative electrical connection. Theprinted circuit board assembly 11 is fastened to a potting shell 22 bymechanical fasteners 29 of sufficient length for attaching said discreteflexible pixel element 10 in finished assembly to a mounting surface orback-plate 36 (see FIGS. 6A and 6B) of an electronic display device.Potting shell 22 is a formed housing of plastic or similar material thatpresents an upper cavity 24 and lower cavity 26 for receiving pottingmaterial. Upper cavity 24 has an upper cavity wall 24 a of sufficientheight to enable said potting material to fill the upper cavity 24 to acavity limit indicated by reference numeral 24 b, thereby to fully covera proximal lower portion of light emitting elements 13. The electricalconductors 13 a of the light emitting elements 13, as well as the pixelelement electronics 15, are completely encapsulated. However, the distalupper portions of the light emitting elements 13 are not encapsulatedthus providing an unobstructed transmission of light from the flexiblepixel element 10.

A lower cavity wall 26 a has a sufficient height to enable pottingmaterial to fill the lower cavity 26 to a limit, indicated by referencenumeral 26 b, which is sufficient to fully cover flexible cable headers17, 19 and a proximal portion of flexible cables 18, thereby fullyencapsulating flexible cable headers 17, 19, as well as the underside ofthe printed circuit board assembly 11 and further providing strainrelief to flexible cables 18.

FIGS. 3A and 3B are top and bottom isometric views of potting assembly20. A potting material 28 is applied in sufficient quantity (partiallyshown) to fill the upper cavity 24 of potting shell 22 to the upperlimit of the interior cavity wall 24 a without overflow and to fill thelower cavity 26 of potting shell 22 to the upper limit of interiorcavity wall 26 a without overflow. Potting material 28 may be anyconventional potting material, such as epoxy or polyurethane pottingcompounds, having optimal performance characteristics and propertiesefficacious for encapsulating pixel element electronics 15 of discreteflexible pixel assembly 10, to-whit:

-   -   (1) potting material 28 is a thermally, chemically and        electrically inert material that, when hardened, protects pixel        element electronics 15 from moisture, humidity, solar radiation,        atmospheric pressure changes, vacuum, corrosive chemicals,        electrical shock, thermal shock, mechanical shock, and other        detrimental environmental effects;    -   (2) potting material 28 is a viscous material with optimal flow        properties for application in predetermined quantities for        filling upper cavity 24 and lower cavity 26 of potting shell 22,        either by manual application or by machine application, such as        by a meter-mix-dispense (MMD) method, at optimal speed without        overflow;    -   (3) potting material 28 is a sublimating material with optimal        state change characteristics to enable rapid hardening, either        by self-sublimation through exposure to atmosphere or by use of        a hardening agent;    -   (4) potting material 28 is an adhesive material with optimal        adhesion characteristics to fully bond with interior cavity        walls 24 a, 26 a of potting shell 22 without requiring separate        adhesion means;    -   (5) potting material 28 is a volumetrically stable material that        exhibits minimum shrinkage after hardening;    -   (6) potting material 28 is a thermally conductive material with        exothermic characteristics for transmitting heat generated by        pixel element electronics 15 to the environment at a rate        sufficient to prevent thermal overload;    -   (7) potting material 28 is a strong material when hardened and        exhibits optimal compressive strength to enable mounting        discrete flexible pixel assemblies by mechanical fasteners 29        without damage; and,    -   (8) potting material 28 is a temperature resistant material when        hardened and exhibits insensitivity to ambient temperature        within an operating range optimal for use in outdoor        applications of discrete flexible pixel elements 10 in        electronic display devices.

Once applied, potting material 28 is allowed to harden in a state changesublimation by exposure to the atmosphere or through the use of ahardening agent, thereby completing encapsulation of pixel elementelectronics 15 within potting assembly 20.

Those skilled in the art will apprehend that the foregoing performancecharacteristics and properties of potting material 28 for use indiscrete flexible pixel elements 10 involves various design choices andtradeoffs in the selection of optimal characteristics thereof.Accordingly, reference to the performance characteristics and propertiesof potting material 28 shall not be considered limiting in scope of thetypes and formulations of potting materials 28 that may efficaciously beused with discrete flexible pixel elements 10.

FIG. 4 is an exploded isometric assembly view of a discrete flexiblepixel element 10 showing potting assembly 20, top encasement cover 30,bottom gasket 32, and potting material 28 residing in the pottingassembly 20. Top encasement cover 30 is a formed housing of an opticallyopaque plastic or similar material that has a cavity 30 a of sufficientvolume to operatively to receive an upper portion of potting assembly 20therein and presenting a ring recess 30 b within top encasement cover 30for receiving a corresponding ring protrusion 22 a of potting shell 22enabling top encasement cover 30 to engage and conjoin potting shell 22mechanically by snapping into place therewith. The top surface of thetop encasement cover 30 also includes a plurality of holes 31 a-31 n foraccommodating the partial protrusion of the light emitting elements 13.

Bottom gasket 32 is a formed pliable gasket of plastic, rubber orsimilar durable material that has a ring extension 32 a corresponding toa ring recess 34 formed by a recess 22 b in potting shell 22 and acorresponding recess 30 c in top encasement cover 30 when mechanicallyconjoined, as heretofore described. Bottom gasket 32 mechanicallyengages ring recess 34 by inserting the ring extension 32 a therein inorder to effect a closure between the top encasement cover 30 at recess30 c and potting shell 22 at recess 22 b.

Advantageously, top encasement cover 30 operatively engages with andconjoins potting shell 22, and bottom gasket 32 operatively engages withand conjoins both top encasement cover 30 and potting shell 22, by meansof a mechanical fit and reliance on tension and compression forceswithout requiring the use of an adhesive or recourse to mechanicalfasteners during assembly, thus reducing the cost of manufacture andfurther enabling recovery of the top encasement cover 30 and bottomgasket 32 on failure or damage of pixel element electronics 15.

FIG. 5 is an assembled view of the components of FIG. 4.

FIG. 6A is a cutaway assembly view of discrete flexible pixel element 10showing potting assembly 20, potting material 28, top encasement cover30, and bottom gasket 32 in final assembly embodying an hermeticallysealed, unitary, self-contained replaceable module. As shown, aplurality of light emitting elements 13 protrudes through an equalplurality of through-holes 31 a-31 n in the top encasement cover 30 topresent an upper portion of said plurality of light emitting elements 13to the exterior side of top encasement cover 30 permitting anunobstructed transmission of light. Mechanical fasteners 29 may befixedly attached to a mounting surface or to a back plate 36 of anelectronic display device. Alternatively, mechanical fasteners 29 may beconjoined to a detachable footing (not shown) that allows discreteflexible pixel elements 10 to be positioned in a non-fixed condition.Input connector 14 engages with and mechanically conjoins outputconnector 16 a of the previous series connected discrete flexible pixelelement 10 a. Output connector 16 engages with and mechanically conjoinsinput connector 14 b of the next series connected discrete flexiblepixel element 10 b.

FIG. 6B is a cutaway assembly view similar to FIG. 6A but with a stringof discrete flexible pixel elements 10 attached to a non-planar orirregular mounting surface 36.

FIG. 7 is a cutaway assembly view of input connector 14 and outputconnector 16 showing internal components and corresponding fitmentfeatures enabling same to engage with and conjoin in closed mechanicalfitment thereby to establish a sealed barrier to the atmosphere. Inputconnector shell 40 is a formed housing of plastic or similarelectrically nonconductive material that supports a plurality of captiveinput terminal contacts 41 a of flexible cable 18 a. Similarly, outputconnector shell 44 is a formed housing of plastic or similarelectrically nonconductive material that supports a plurality of captiveoutput terminal contacts 41 b of flexible cable 18 b. An input connectorkey 42 a mechanically engages with and conjoins a corresponding outputconnector key 42 b. An input connector protrusion 43 a mechanicallyengages with and conjoins a corresponding output connector recess 43 bby snapping into place. Input connector 14 with input terminal contacts41 a mechanically engage with and conjoin output connector 16 withoutput terminal contacts 41 b in operative electrical connectiontherewith. Potting material 28 is applied to cavity 40 a of inputconnector housing 40 to encapsulate and seal flexible cable 18 a andproviding strain relief and potting material is similarly applied tocavity 44 a of output connector housing 44 for the same purpose. Uponengagement and mechanical connection, the terminal contacts 41 a ofinput connector 14 engage with corresponding terminal contacts 41 b ofoutput connector 16 in a close mechanical fit thereby effecting anoperative electrical connection between the input terminal contacts 41 aand output terminal contacts 41 b and simultaneously isolating them fromthe outside environment by virtue of the sealed barrier to theatmosphere.

Various modifications can be made to the present invention withoutdeparting from the apparent scope thereof.

PARTS LIST

-   -   10: discrete flexible pixel element;    -   11: printed circuit board assembly;    -   13: light emitting elements;    -   13 a: electrical conductors;    -   14: input connector;    -   15: pixel element electronics;    -   15 a: pixel element drivers;    -   16: output connector;    -   17: flexible cable header;    -   18: flexible cables;    -   19: flexible cable header;    -   20: potting assembly;    -   22: potting shell;    -   22 a: ring protrusion;    -   22 b: recess;    -   24: upper cavity;    -   24 a: upper cavity wall;    -   24 b: cavity limit;    -   26: lower cavity;    -   26 a: lower cavity wall;    -   26 b: cavity limit;    -   28: potting material;    -   29: mechanical fasteners;    -   30: top encasement cover;    -   30 a: cavity;    -   30 b: ring recess;    -   30 c: recess;    -   31 a-n: holes;    -   32: bottom gasket;    -   32 a: ring extension;    -   34: ring recess;    -   36: back plate;    -   40: input connector shell;    -   40 a: cavity;    -   41 a: input terminal contacts;    -   41 b: output terminal contacts;    -   42 a: input connector key;    -   42 b: output connector key;    -   43 a: input connector protrusion;    -   43 b: output connector recess;    -   44: output connector shell; and    -   44 a: cavity.

In the appended claims, the terms “including” and “in which” are used asthe plain-English equivalents of the respective terms “comprising” and“wherein.” Also, in the following claims, the terms “including” and“comprising” are open-ended, that is, a system, assembly, device,apparatus, article, or process that includes elements in addition tothose listed after such a term in a claim are still deemed to fallwithin the scope of that claim. Moreover, in the following claims, theterms “first,” “second,” and “third,” etc. are used merely as labels,and are not intended to impose numerical requirements on their objects.

The Abstract is provided to comply with 37 C.F.R. §1.72(b), to allow thereader to quickly ascertain the nature of the technical disclosure. Itis submitted with the understanding that it will not be used tointerpret or limit the scope or meaning of the claims. Also, in theabove Detailed Description, various features may be grouped together tostreamline the disclosure. This should not be interpreted as intendingthat an unclaimed disclosed feature is essential to any claim. Rather,inventive subject matter may lie in less than all features of aparticular disclosed embodiment. Thus, the following claims are herebyincorporated into the Detailed Description, with each claim standing onits own as a separate embodiment. The scope of the invention should bedetermined with reference to the appended claims, along with the fullscope of equivalents to which such claims are entitled.

1-20. (canceled)
 21. A sealed module comprising: a circuit boardincluding one or more light-emitting elements coupled to a first surfaceof the circuit board; and an encapsulating material encapsulating andsealing at least a portion of the first surface of the circuit boardfrom an environment exterior.
 22. The sealed module of claim 21, furthercomprising a potting shell coupled to the circuit board, the pottingshell including at least one cavity at least partially enclosing the oneor more light-emitting elements, wherein the encapsulating material isdisposed within the at least one cavity.
 23. The sealed module of claim22, further comprising an encasement cover having an internal cavityconfigured to receive at least a portion of the potting shell, thecircuit board, the one or more light emitting elements, and theencapsulating material.
 24. The sealed module of claim 22, wherein theat least one cavity is a first cavity and wherein the potting shellincludes a second cavity extending from the circuit board in an opposeddirection to the first cavity, the sealed module further comprisingsecond encapsulating material disposed within the second cavity.
 25. Thesealed module of claim 21, wherein the portion of the first surface ofthe circuit board being encapsulated and sealed includes a portionsurrounding each of the light-emitting elements.
 26. The sealed moduleof claim 21, wherein the encapsulating material encapsulates and sealsat least a portion of each of the light-emitting elements from theenvironment exterior.
 27. The sealed module of claim 21, wherein theencapsulating material comprises at least one of a ductile foam, amalleable solid potting material, a potting resin configured harden onexposure to the atmosphere, heat, or a reactive agent, and a potting gelconfigured to harden on exposure to the atmosphere, heat, or a reactiveagent, a potting resin and a potting gel that is configured to harden onexposure to the atmosphere, heat, or a reactive agent.
 28. The sealedmodule of claim 21, wherein the encapsulating material hermeticallyseals at least the first surface of the circuit board from theenvironment exterior.
 29. The sealed module of claim 21, wherein thepotting shell is coupled to a perimeter of the circuit board.
 30. Thesealed module of claim 21, comprising one or more connectors coupled tothe circuit board, the one or more connectors configured for input tothe circuit board or output from the circuit board, or both.
 31. Thesealed pixel module of claim 30, wherein each of the one or moreconnectors are configured for coupling with at least one other sealedmodule to provide an electronic display device.
 32. The sealed pixelmodule of claim 30, wherein the encapsulating material encapsulates andseals at least a portion of the one or more connectors.
 33. The sealedpixel module of claim 30, wherein the one or more connectors compriseone or more cables.
 34. The sealed module of claim 21, wherein theencapsulating material encapsulates and seals the portion of the circuitboard and at least a portion of each of the one or more lightingelements from at least one of moisture, humidity, solar radiation,atmospheric pressure changes, vacuum, corrosive chemicals, electricalshock, thermal shock, and mechanical shock.
 35. A method comprising:providing or receiving a plurality of first sealed modules, wherein eachfirst sealed module includes a first circuit board, one or more firstlight emitting elements coupled to the first circuit board, a firstencapsulation material covering and sealing at least a portion of thefirst circuit board from an environment exterior, one or more firstinput connectors electrically coupled to the first circuit board, andone or more first output connectors electrically coupled to the firstcircuit board; and connecting the plurality of first sealed modules toform a first flexible pixel string by serially electrically coupling thefirst input and the first output connectors of adjacent first sealedmodules.
 36. The method of claim 35, further comprising: providing orreceiving a plurality of second sealed modules, wherein each secondsealed module includes a second circuit board, one or more second lightemitting elements coupled to the second circuit board, a secondencapsulation material covering and sealing at least a portion of thesecond circuit board from the environment exterior, one or more secondinput connectors electrically coupled to the second circuit board, andone or more second output connectors electrically coupled to the secondcircuit board; connecting the plurality of second sealed modules to forma second flexible pixel string by serially electrically coupling thesecond input connectors and the second output connectors of adjacentsecond sealed modules; and combining at least the first flexible pixelstring and the second flexible pixel string to form an electronicdisplay.
 37. The method of claim 35, further comprising coupling one ormore of the plurality of the first sealed modules of the first flexiblepixel string to a mounting surface.
 38. The method of claim 35, whereinthe encapsulating material of each of the plurality of first sealedmodules encapsulates and seals at least a portion of each of the firstlight-emitting elements from the environment exterior.
 39. The method ofclaim 35, wherein the encapsulating material of each of the plurality offirst sealed modules protects against at least one of moisture andhumidity.
 40. The method of claim 39, wherein the encapsulating materialof each of the plurality of first sealed modules further protectsagainst at least one of solar radiation, atmospheric pressure change,vacuum, corrosive chemicals, electrostatic shock, thermal shock, andmechanical shock.